Vertiv unveils MegaMod CoolChip for rapid AI infrastructure deployment

Vertiv has unveiled the Vertiv MegaMod CoolChip, a liquid cooling-equipped prefabricated modular (PFM) data centre solution, aimed at supporting the efficient and reliable operation of artificial intelligence (AI) computing.

This new solution is said to expedite the deployment of AI critical digital infrastructure by up to 50 percent compared to traditional onsite builds.

The Vertiv MegaMod CoolChip integrates several technologies, including high-density liquid cooling, designed to deliver turnkey infrastructure solutions efficiently. This product can be customised to align with the platforms of leading AI compute providers and scaled according to customer requirements. The high-density prefabricated modular data centre can either be retrofitted into existing facilities or constructed as a new freestanding data centre, capable of supporting high-power CPU and GPU operations.

Viktor Petik, vice president of Vertiv infrastructure solutions, commented, "MegaMod CoolChip is a fully equipped critical digital infrastructure solution that customers can deploy quickly, and with confidence. Factory assembly and testing in a controlled environment help to accelerate the time to build, as well as providing control over cost and schedules. The addition of this solution to our portfolio provides more flexibility to successfully accelerate AI."

Recent research by Omdia highlights an increase in the demand for prefabricated modular and micro data centre solutions, driven by the needs of AI. Vertiv maintains a leading global position in this market. Engineers at Vertiv have leveraged their experience with prefabricated solutions, focusing on the specific demands of AI deployments, to develop the MegaMod CoolChip.

Key features of the Vertiv MegaMod CoolChip include high-density compute and cooling infrastructures. The system supports various IT systems from the customers' chosen AI compute providers, which can include accelerated computing platforms housed in equipment racks outfitted with integrated plumbing and high-density rack power distribution units (rPDUs). Additionally, the solution features Vertiv chillers and cooling distribution units (CDUs) for direct-to-chip cooling, optimising the efficiency of heat removal from both high-power CPUs and GPUs.

Moreover, MegaMod CoolChip employs high-efficiency power protection and distribution technologies. Vertiv power solutions ensure complete power protection and distribution from the utility to the computing rack. This includes integration with Vertiv's Trinergy uninterruptible power supply (UPS) and the Vertiv PowerNexus solution, which reduces the power system footprint through close coupling of the UPS and switchgear.

The modular nature of the assembly of MegaMod CoolChip prefabricated units provides flexibility, suitable for new builds, retrofits, and expansions. These units are assembled and tested in a controlled factory environment, which helps minimise risks and ensure quality.

Vertiv takes on single-source accountability for the entire implementation process, from initial consultation through to configuration, fabrication, installation, and commissioning. This approach aims to streamline processes, reduce customer resource demands, and provide controlled cost and schedule efficiencies.

The Vertiv MegaMod CoolChip solution also promotes sustainability. The advanced technologies employed, such as the direct-to-chip liquid cooling and high-efficiency power infrastructures, improve Power Usage Effectiveness (PUE), leading to a reduced carbon footprint compared to traditional data centres.

The Vertiv MegaMod CoolChip is available globally and supports a range of high-density AI compute needs, facilitating the rapid deployment of AI critical digital infrastructure.