New heat sinks cool NVIDIA Jetson Thor edge modules

Advanced Thermal Solutions (ATS) has officially introduced a sophisticated new line of heat sinks specifically engineered for the NVIDIA Jetson Thor modules. This comprehensive range, comprising both active and passive thermal management designs, is meticulously crafted to meet the rigorous demands of edge computing, physical artificial intelligence, and robotics systems that require sustained high-performance capabilities in challenging environments.

The company has confirmed that the newly launched portfolio includes two active cooling solutions and one passive heat sink. Each individual product has been precision-engineered to address distinct Thermal Design Power (TDP) ratings and specific system airflow profiles, ensuring that developers can select the optimal cooling solution for their particular hardware configuration. To streamline the integration process for manufacturers, Advanced Thermal Solutions noted that all units are supplied with a pre-assembled thermal interface material (TIM), facilitating immediate and efficient installation.

Active Options

One model uses a frameless fan embedded in an aluminium fin field. Advanced Thermal Solutions said the unit can cool 95W TDP devices at 50°C. The company listed dimensions of 87 x 100.8 x 20 mm and a weight of 104g.

A second active design uses a top-mounted ATS blower. Advanced Thermal Solutions said the design can cool 175W TDP devices at 50°C. The company listed dimensions of 92 x 100.8 x 28.6 mm including the blower, and a weight of 174g.

Passive Cooling

The passive heat sink uses aluminium construction. Advanced Thermal Solutions said it provides up to 100W of cooling at 50°C with 500 LFM of system airflow. The company listed dimensions of 87 x 100.8 x 20 mm and a weight of 168g.

Advanced Thermal Solutions positioned the line as a response to higher heat loads in compact computing modules used outside traditional data centre environments.

"The unprecedented compute density of Jetson Thor pushes thermal requirements beyond what traditional embedded cooling solutions can support," said Advanced Thermal Solutions.

NVIDIA markets Jetson Thor as part of its Jetson series for embedded AI and robotics. Advanced Thermal Solutions referenced performance figures that NVIDIA has cited for the modules, including up to 2070 FP4 TFLOPS of AI compute and 128 GB of memory. The company described the power envelope as 40-130 W.

The launch adds to a broader ecosystem of third-party hardware designed around NVIDIA's system-on-module format. Heat sinks and other thermal assemblies remain an area of focus as AI models increase compute intensity and sustained workloads become more common in industrial machines, mobile robots and edge servers.

Advanced Thermal Solutions said it provides cooling products across the Jetson range of system-on-modules. It also outlined a wider portfolio that spans air cooling, liquid cooling and refrigeration approaches, along with laboratory and test equipment for thermal measurement.

The company said it designs and manufactures thermal management products, and it cited engineering and software development operations in the US and India. It also described manufacturing in Norwood, Massachusetts and partnerships with global manufacturers, along with distribution operations in Asia.

Advanced Thermal Solutions said the Jetson Thor heat sinks are available for immediate shipping.