UMC stories
Risk production of optical transceiver chips is slated for 2026 and 2027 as UMC moves silicon photonics onto 12-inch wafers.
Intel advances chip tech with new process nodes, packaging options, and partnerships, boosting foundry services and US-based production.
Siemens Digital Industries Software has launched Calibre 3DThermal, a cutting-edge tool for thermal analysis and debugging in 3D integrated circuits, enhancing design reliability.
Intel and global semiconductor foundry, UMC, reveal partnership to create a 12-nanometer semiconductor process platform, diversifying supply chains and expanding sourcing options for clients.
