Vertiv unveils AI-ready modular data centre with liquid cooling

Vertiv has announced the launch of the Vertiv MegaMod CoolChip, a liquid cooling-equipped prefabricated modular data centre solution designed to support artificial intelligence (AI) computing. This solution aims to facilitate efficient and reliable AI computing infrastructure by leveraging offsite fabrication and AI-ready technologies. According to Vertiv, MegaMod CoolChip can reduce the time required to deploy AI-critical digital infrastructures by up to 50%.

Vertiv's new product, MegaMod CoolChip, integrates advanced technologies such as high-density liquid cooling to provide a turnkey solution for AI digital infrastructure deployment. It can be configured to support leading AI computing platforms and can be scaled to meet specific customer requirements. The solution is available globally and can serve as a modular retrofit for existing facilities or as a new standalone data centre, capable of supporting hundreds of kilowatts per row and up to several megawatts with prefabricated units.

Viktor Petik, vice president of Vertiv infrastructure solutions, commented on the new launch: "MegaMod CoolChip is a fully equipped critical digital infrastructure solution that customers can deploy quickly, and with confidence. Factory assembly and testing in a controlled environment help to accelerate the time to build, as well as providing control over cost and schedules. The addition of this solution to our portfolio provides more flexibility to successfully accelerate AI."

Research from Omdia indicates that the demand for prefabricated modular and micro data centre solutions has increased due to AI. In response to this trend, Vertiv engineers have applied experience from previous prefabricated solutions to develop MegaMod CoolChip, ensuring it meets the evolving AI requirements. Key features of the solution include high-density compute support, high-density liquid cooling infrastructure, high-efficiency power protection and distribution, modular assembly, and single-source accountability.

The MegaMod CoolChip supports IT systems from various AI computing providers, including accelerated computing platforms integrated into equipment racks with plumbing and high-density Vertiv rack power distribution units (PDAs). It utilises direct-to-chip cooling to manage heat removal from high-power CPUs and GPUs. Vertiv's cooling distribution units (CDUs) and chillers manage the safe and efficient transport of cooling fluids. Furthermore, the power technologies integrated into the solution include busway, switchgear, and the Vertiv Trinergy uninterruptible power supply (UPS), which works alongside the Vertiv PowerNexus solution to reduce the power system footprint.

Emphasising modularity, MegaMod CoolChip arrives in prefabricated units, including the building enclosure and all building systems. These units can be assembled onsite, and the solution is also available in skid-mounted versions that offer flexibility for new builds, retrofits, and expansions. The factory-controlled environment for assembly and testing minimise risks associated with onsite builds.

The solution aims to enhance sustainability goals for data centre operators and developers by employing advanced technologies such as direct-to-chip liquid cooling and Vertiv power infrastructure. According to Vertiv, these efficiencies enable improved Power Usage Effectiveness (PUE) compared to traditional data centres, reducing carbon footprint.