DataCenterNews Asia - Asetek announces data center partnership with NEC

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Asetek announces data center partnership with NEC

NEC Corporation, through its subsidiary NEC Fielding, will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC (High Performance Computing) installation in Japan.

Asetek has already begun to make shipments in support of this installation.

This follows the announcement of an undisclosed OEM partner on September 7th, 2017.

“Adding OEMs has been a key goal for our datacenter business and it is particularly satisfying to add another significant OEM to our portfolio of customers,” André Sloth Eriksen, Asetek CEO and founder said at the time.

“This order confirms our ability to leverage our leading position in the HPC segment to attract new customers as well as end-users.”  

Asetek is a provider of liquid cooling solutions for data centers, servers and PCs.

Founded in 2000, Asetek is headquartered in Denmark and has operations in California, Texas, China and Taiwan. Asetek is listed on the Oslo Stock Exchange (ASETEK).

“We are pleased to work with NEC on this project and look forward to further collaboration in the future,” says John Hamill, Asetek Chief Operating Officer.

“Partnering with leading OEMs such as NEC is a cornerstone of our strategy to develop the emerging data center market.”   

NEC Corporation provides a combination of products and solutions that cross utilize the company's experience and global resources.

NEC's aims to meet the complex and ever-changing needs of its customers.

NEC brings more than 100 years of expertise in technological innovation to empower people, businesses and society. 

Noritaka Hoshi, NEC Corporation senior manager says, “Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high-density HPC clusters, adding value for our end-users.”

Asetek RackCDU D2C is a hot water liquid cooling solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density. 

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